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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status Other Names ECCN HTSUS Standard Package Current Rating (Amps) Housing Material Material Flammability Rating Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
284-1273-00-1102JH 3M 284-1273-00-1102JH -
RFQ
ECAD 1215 0.00000000 3M OEM Bulk Obsolete -55°C ~ 105°C Through Hole PLCC Open Frame 284 Solder download RoHS Compliant Not Applicable EAR99 8536.69.4040 100 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Gold Flash 84 (4 x 21) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.100" (2.54mm) -
40-1518-10 Aries Electronics 40-1518-10 3.6562
RFQ
ECAD 7793 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.2" (5.08mm) Row Spacing Open Frame 40-1518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
614-87-628-41-001101 Preci-Dip 614-87-628-41-001101 1.6947
RFQ
ECAD 3140 0.00000000 Preci-Dip 614 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Carrier, Open Frame 614-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.136" (3.45mm) 10mOhm
123-43-650-41-001000 Mill-Max Manufacturing Corp. 123-43-650-41-001000 20.1480
RFQ
ECAD 4567 0.00000000 Mill-Max Manufacturing Corp. 123 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 123-43 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.510" (12.95mm) 10mOhm
523-93-072-11-061001 Mill-Max Manufacturing Corp. 523-93-072-11-061001 -
RFQ
ECAD 9785 0.00000000 Mill-Max Manufacturing Corp. 523 Bulk Active - Through Hole PGA - 523-93 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 72 (11 x 11) - 0.100" (2.54mm) - 0.510" (12.95mm) -
ICA-318-ZWTT Samtec Inc. ICA-318-ZWTT 4.3212
RFQ
ECAD 2014 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-318-ZWTT 25 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Tin - Tin - 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
522-13-069-11-061003 Mill-Max Manufacturing Corp. 522-13-069-11-061003 -
RFQ
ECAD 5271 0.00000000 Mill-Max Manufacturing Corp. 522 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 522-13 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 69 (11 x 11) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.370" (9.40mm) 10mOhm
145-PGM15024-10 Aries Electronics 145-PGM15024-10 18.2274
RFQ
ECAD 8337 0.00000000 Aries Electronics PGM Bulk Active -55°C ~ 105°C Through Hole PGA - 145-PGM Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Brass 0.165" (4.19mm) -
40-9513-10T Aries Electronics 40-9513-10T 6.8478
RFQ
ECAD 1835 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 40-9513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
510-83-160-16-081101 Preci-Dip 510-83-160-16-081101 8.4756
RFQ
ECAD 9361 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-83 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin - 160 (16 x 16) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
110-43-420-61-001000 Mill-Max Manufacturing Corp. 110-43-420-61-001000 20.5615
RFQ
ECAD 2969 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Through Hole DIP, 0.4" (10.16mm) Row Spacing 110-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 20 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
ICF-316-STL-O Samtec Inc. ICF-316-STL-O 6.6900
RFQ
ECAD 9243 0.00000000 Samtec Inc. ICF Bulk Active -55°C ~ 125°C Surface Mount DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICF-316-STL-O 1 Liquid Crystal Polymer (LCP) - 0.100" (2.54mm) Tin - Tin - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Beryllium Copper - -
515-13-088-12-052003 Mill-Max Manufacturing Corp. 515-13-088-12-052003 -
RFQ
ECAD 9911 0.00000000 Mill-Max Manufacturing Corp. 515 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 515-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 88 (12 x 12) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.108" (2.74mm) 10mOhm
ICA-320-SGG-L Samtec Inc. ICA-320-SGG-L 7.0573
RFQ
ECAD 5666 0.00000000 Samtec Inc. ICA Tube Active -55°C ~ 125°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame Solder download ROHS3 Compliant 612-ICA-320-SGG-L 22 1 A Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 30.0µin (0.76µm) 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) Brass 10mOhm
280-5205-01 3M 280-5205-01 164.2200
RFQ
ECAD 10 0.00000000 3M Textool™ Bulk Active - Through Hole QFN Open Frame 280 Solder download RoHS Compliant 1 (Unlimited) EAR99 8536.69.4040 5 Polyethersulfone (PES) - 0.020" (0.50mm) Gold - Gold - 80 (4 x 20) Beryllium Copper 0.020" (0.50mm) Beryllium Copper 0.114" (2.90mm) 25mOhm
546-87-168-17-101136 Preci-Dip 546-87-168-17-101136 15.1604
RFQ
ECAD 6389 0.00000000 Preci-Dip 546 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 546-87 Press-Fit download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 12 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.050" (1.27mm) Gold Flash Tin - 168 (17 x 17) Beryllium Copper 0.100" (2.54mm) Bronze 0.098" (2.50mm) 10mOhm
28-8620-610C Aries Electronics 28-8620-610C 16.0982
RFQ
ECAD 9537 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 28-8620 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
56-PRS14031-12 Aries Electronics 56-PRS14031-12 78.5350
RFQ
ECAD 2612 0.00000000 Aries Electronics PRS Bulk Active -65°C ~ 125°C Through Hole PGA, ZIF (ZIP) Closed Frame 56-PRS1 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS) UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) - Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.125" (3.18mm) -
127-93-642-41-002000 Mill-Max Manufacturing Corp. 127-93-642-41-002000 17.4331
RFQ
ECAD 6137 0.00000000 Mill-Max Manufacturing Corp. 127 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 127-93 Wire Wrap download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 13 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.370" (9.40mm) -
24-651000-10 Aries Electronics 24-651000-10 32.8877
RFQ
ECAD 3712 0.00000000 Aries Electronics Correct-A-Chip® 651000 Bulk Active - Through Hole - 24-6510 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.026" (0.65mm) - - Tin-Lead 200.0µin (5.08µm) SSOP DIP, 0.6" (15.24mm) Row Spacing 24 - 0.100" (2.54mm) Brass 0.145" (3.68mm) FR4 Epoxy Glass
12-0508-20 Aries Electronics 12-0508-20 4.8742
RFQ
ECAD 7433 0.00000000 Aries Electronics 508 Bulk Active -55°C ~ 105°C Through Hole SIP - 12-0508 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6 UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 12 (1 x 12) Beryllium Copper - Brass 0.360" (9.14mm) -
16-8250-310C Aries Electronics 16-8250-310C 10.0717
RFQ
ECAD 1367 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8250 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
0500-1.900 Aries Electronics 0500-1.900 -
RFQ
ECAD 1974 0.00000000 Aries Electronics - - Active - - - - 0500-1 - download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - - - - - - - - - - - -
117-43-648-61-005000 Mill-Max Manufacturing Corp. 117-43-648-61-005000 25.6293
RFQ
ECAD 4334 0.00000000 Mill-Max Manufacturing Corp. 117 Tube Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 117-43 Solder - ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 11 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 0.070" (1.78mm) Brass Alloy 0.125" (3.18mm) -
110-47-650-41-105000 Mill-Max Manufacturing Corp. 110-47-650-41-105000 16.3768
RFQ
ECAD 4662 0.00000000 Mill-Max Manufacturing Corp. 110 Tube Active -55°C ~ 125°C Surface Mount DIP, 0.6" (15.24mm) Row Spacing Open Frame 110-47 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 8 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold Flash Tin 200.0µin (5.08µm) 50 (2 x 25) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.125" (3.18mm) 10mOhm
614-13-196-14-000007 Mill-Max Manufacturing Corp. 614-13-196-14-000007 -
RFQ
ECAD 7911 0.00000000 Mill-Max Manufacturing Corp. 614 Bulk Active -55°C ~ 125°C Through Hole PGA Carrier, Closed Frame 614-13 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 196 (14 x 14) Beryllium Copper 0.100" (2.54mm) Brass Alloy 0.146" (3.71mm) 10mOhm
2301-9621-00-2401 3M 2301-9621-00-2401 -
RFQ
ECAD 4511 0.00000000 3M Textool™ Box Active - - - - 2301 - - RoHS Compliant Not Applicable 5 - - - - - - - - - - - - -
0479890132 Molex 0479890132 -
RFQ
ECAD 8932 0.00000000 Molex 47989 Tray Obsolete - Surface Mount PGA Open Frame 047989 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 560 Liquid Crystal Polymer (LCP) UL94 V-0 0.039" (1.00mm) Gold 15.0µin (0.38µm) - - 989 (35 x 36) Copper Alloy 0.039" (1.00mm) - - -
510-87-299-20-091101 Preci-Dip 510-87-299-20-091101 10.1906
RFQ
ECAD 6522 0.00000000 Preci-Dip 510 Bulk Active -55°C ~ 125°C Through Hole PGA Open Frame 510-87 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 10 1 A Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Tin - 299 (20 x 20) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) 10mOhm
SA286040 On Shore Technology Inc. SA286040 1.3900
RFQ
ECAD 2 0.00000000 On Shore Technology Inc. SA Tube Active -40°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame SA28604 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected ED3029 EAR99 8536.69.4040 17 3 A Thermoplastic, Polyester, Glass Filled UL94 V-0 0.100" (2.54mm) Gold Flash Gold 80.0µin (2.03µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass - 4mOhm
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse